Kelvin Thermal develops the thinnest cooling solutions for smartphones, tablets, laptop PCs, ARs/VRs, high performance computing, telecommunication, and satellites. We are recognized as the world leader in thermal ground planes, i.e. vapor chambers and 2-D heat pipes. The company is a startup with technologies developed in a DARPA project conducted at the University of Colorado Boulder from 2008 to 2013. Our main focus is on research and development for novel thermal solutions for future mobile systems. These solutions are commercialized through partnerships with other companies in the US, Asia and Europe. In addition, our engineers in Taiwan branch are finalizing mass production facilities for three new products. Kelvin Thermal is a stimulating job environment for those who seeking a place that challenges your imagination and creativity. Here is our accomplishments: first thin and flexible vapor chamber in 2015; world’s thinnest vapor chamber in 2018 (thinnest even today); world’s first RF transparent polymer vapor chamber in 2020; world’s only foldable vapor chamber reaching 200K cycles in 2022; world’s highest heat flux (450W/cm2) vapor chamber for HPC developed in 2022; and world’s lightest vapor chamber in 2022.
